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1. product profile 1.1 general description pnp medium power transistor series in su rface-mounted device (smd) plastic packages. [1] valid for all avail able selection groups. 1.2 features and benefits ? high current ? three current gain selections ? high power dissipation capability ? exposed heatsink for excellent thermal and electrical conductivity (sot89, sot1061) ? leadless very small smd pl astic package with medium power capability (sot1061) ? aec-q101 qualified 1.3 applications 1.4 quick reference data bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors rev. 7 ? 12 october 2011 product data sheet table 1. product overview type number [1] package npn complement nxp jeita jedec bcp69 sot223 sc-73 - bcp68 bc869 sot89 sc-62 to-243 bc868 bc69pa sot1061 - - bc68pa ? linear voltage regulators ? power management ? high-side switches ? mosfet drivers ? battery-driven devices ? amplifiers table 2. quick reference data symbol parameter conditions min typ max unit v ceo collector-emitter voltage open base - - ? 20 v i c collector current - - ? 2a i cm peak collector current single pulse; t p ? 1ms - - ? 3a
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 2 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors [1] pulse test: t p ? 300 ? s; ? = 0.02. 2. pinning information h fe dc current gain v ce = ? 1v; i c = ? 500 ma [1] 85 - 375 h fe selection -16 v ce = ? 1v; i c = ? 500 ma [1] 100 - 250 h fe selection -25 v ce = ? 1v; i c = ? 500 ma [1] 160 - 375 table 2. quick reference data ?continued symbol parameter conditions min typ max unit table 3. pinning pin description simplified outline graphic symbol sot223 1base 2 collector 3emitter 4 collector sot89 1emitter 2 collector 3base sot1061 1base 2emitter 3 collector 13 2 4 sym028 2, 4 3 1 321 006aaa231 2 1 3 transparent top view 12 3 sym013 3 2 1
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 3 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors 3. ordering information [1] valid for all avail able selection groups. 4. marking table 4. ordering information type number [1] package name description version bcp69 sc-73 plastic surface-mounted package with increased heatsink; 4 leads sot223 bc869 sc-62 plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads sot89 bc69pa huson3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 ? 2 ? 0.65 mm sot1061 table 5. marking codes type number marking code bcp69 bcp69 bcp69-16 bcp69/16 bcp69-25 bcp69/25 bc869 cec bc869-16 cgc bc869-25 chc bc69pa b3 BC69-16PA bm bc69-25pa bn
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 4 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors 5. limiting values [1] device mounted on an fr4 printed-circuit board (p cb), single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided copper , tin-plated, mounting pad for collector 1 cm 2 . [3] device mounted on an fr4 pcb, single-sided copper , tin-plated, mounting pad for collector 6 cm 2 . [4] device mounted on an fr4 pcb, 4-layer copper, tin-plated and standard footprint. [5] device mounted on an fr4 pcb, 4-layer copper, tin-plated, mounting pad for collector 1 cm 2 . table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cbo collector-base voltage open emitter - ? 32 v v ceo collector-emitter voltage open base - ? 20 v v ebo emitter-base voltage open collector - ? 5v i c collector current - ? 2a i cm peak collector current single pulse; t p ? 1ms - ? 3a i b base current - ? 0.4 a i bm peak base current single pulse; t p ? 1ms - ? 0.4 a p tot total power dissipation t amb ? 25 ?c bcp69 [1] -0.65w [2] -1.00w [3] -1.35w bc869 [1] -0.50w [2] -0.95w [3] -1.35w bc69pa [1] -0.42w [2] -0.83w [3] -1.10w [4] -0.81w [5] -1.65w t j junction temperature - 150 ?c t amb ambient temperature ? 55 +150 ?c t stg storage temperature ? 65 +150 ?c
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 5 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors (1) fr4 pcb, mounting pad for collector 6 cm 2 (2) fr4 pcb, mounting pad for collector 1 cm 2 (3) fr4 pcb, standard footprint (1) fr4 pcb, mounting pad for collector 6 cm 2 (2) fr4 pcb, mounting pad for collector 1 cm 2 (3) fr4 pcb, standard footprint fig 1. power derating curves sot223 fig 2. power derating curves sot89 (1) fr4 pcb, 4-layer copper, mounting pad for collector 1 cm 2 (2) fr4 pcb, single-sided copper, mounting pad for collector 6 cm 2 (3) fr4 pcb, single-sided copper, mounting pad for collector 1 cm 2 (4) fr4 pcb, 4-layer copper, standard footprint (5) fr4 pcb, single-sided copper, standard footprint fig 3. power derating curves sot1061 t amb (c) ?75 175 125 25 75 ?25 006aac674 0.5 1.0 1.5 p tot (w) 0.0 (1) (2) (3) t amb (c) ?75 175 125 25 75 ?25 006aac675 0.5 1.0 1.5 p tot (w) 0.0 (1) (2) (3) t amb (c) ?75 175 125 25 75 ?25 006aac676 1.0 0.5 1.5 2.0 p tot (w) 0.0 (1) (2) (3) (4) (5)
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 6 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors 6. thermal characteristics [1] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided copper , tin-plated, mounting pad for collector 1 cm 2 . [3] device mounted on an fr4 pcb, single-sided copper , tin-plated, mounting pad for collector 6 cm 2 . [4] device mounted on an fr4 pcb, 4-layer copper, tin-plated and standard footprint. [5] device mounted on an fr4 pcb, 4-layer copper, tin-plated, mounting pad for collector 1 cm 2 . table 7. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air bcp69 [1] --192k/w [2] --125k/w [3] --93k/w bc869 [1] --250k/w [2] --132k/w [3] --93k/w bc69pa [1] --298k/w [2] --151k/w [3] --114k/w [4] --154k/w [5] --76k/w r th(j-sp) thermal resistance from junction to solder point bcp69 - - 16 k/w bc869 - - 16 k/w bc69pa - - 20 k/w
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 7 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors fr4 pcb, standard footprint fig 4. transient thermal impedance from junction to am bient as a function of pulse duration for sot223; typical values fr4 pcb, mounting pad for collector 1 cm 2 fig 5. transient thermal impedance from junction to am bient as a function of pulse duration for sot223; typical values 006aac677 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 006aac678 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 8 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors fr4 pcb, mounting pad for collector 6 cm 2 fig 6. transient thermal impedance from junction to am bient as a function of pulse duration for sot223; typical values fr4 pcb, standard footprint fig 7. transient thermal impedance from junction to ambient as a function of pulse duration for sot89; typical values 006aac679 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 006aac680 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 9 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors fr4 pcb, mounting pad for collector 1 cm 2 fig 8. transient thermal impedance from junction to ambient as a function of pulse duration for sot89; typical values fr4 pcb, mounting pad for collector 6 cm 2 fig 9. transient thermal impedance from junction to ambient as a function of pulse duration for sot89; typical values 006aac681 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 006aac682 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 10 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors fr4 pcb, single-sided copper, standard footprint fig 10. transient thermal impedance from junction to ambient as a function of pulse duration for sot1061; typical values fr4 pcb, single-sided copper, mounting pad for collector 1 cm 2 fig 11. transient thermal impedance from junction to ambient as a function of pulse duration for sot1061; typical values 006aac683 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25 006aac684 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 11 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors fr4 pcb, single-sided copper, mounting pad for collector 6 cm 2 fig 12. transient thermal impedance from junction to ambient as a function of pulse duration for sot1061; typical values fr4 pcb, 4-layer copper, standard footprint fig 13. transient thermal impedance from junction to ambient as a function of pulse duration for sot1061; typical values 006aac685 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25 006aac686 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 12 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors fr4 pcb, 4-layer copper, mounting pad for collector 1 cm 2 fig 14. transient thermal impedance from junction to ambient as a function of pulse duration for sot1061; typical values 006aac687 10 1 10 2 10 3 z th(j-a) (k/w) 10 ?1 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 13 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors 7. characteristics [1] pulse test: t p ? 300 ? s; ? = 0.02. table 8. characteristics t amb =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit i cbo collector-base cut-off current v cb = ? 25 v; i e =0a - - ? 100 na v cb = ? 25 v; i e =0a; t j = 150 ?c -- ? 10 ? a i ebo emitter-base cut-off current v eb = ? 5v; i c =0a - - ? 100 na h fe dc current gain v ce = ? 10 v i c = ? 5ma 50 - - dc current gain v ce = ? 1v i c = ? 500 ma [1] 85 - 375 i c = ? 1a [1] 60 - - i c = ? 2a [1] 40 - - dc current gain v ce = ? 1v h fe selection -16 i c = ? 500 ma [1] 100 - 250 h fe selection -25 i c = ? 500 ma [1] 160 - 375 v cesat collector-emitter saturation voltage i c = ? 1a; i b = ? 100 ma [1] -- ? 0.5 v i c = ? 2a; i b = ? 200 ma [1] ? 0.6 v v be base-emitter voltage v ce = ? 10 v; i c = ? 5ma [1] -- ? 0.7 v v ce = ? 1v; i c = ? 1a [1] -- ? 1v c c collector capacitance v cb = ? 10 v; i e =i e =0a; f=1mhz -28-pf f t transition frequency v ce = ? 5v; i c = ? 50 ma; f=100mhz 40 140 - mhz
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 14 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors v ce = ?1v (1) t amb = 100 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c t amb =25 ? c fig 15. h fe selection -16: dc current gain as a function of collector current; typical values fig 16. h fe selection -16: collector current as a function of collector-emitter voltage; typical values v ce = ?1v (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 100 ? c i c /i b =10 (1) t amb = 100 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c fig 17. h fe selection -16: base-emitter voltage as a function of collector current; typical values fig 18. h fe selection -16: collecto r-emitter saturation voltage as a function of collector current; typical values 006aac697 100 200 300 h fe 0 i c (a) -10 -4 -10 -1 -10 -3 -10 -1 -10 -2 (1) (2) (3) 006aab403 0 i c (a) v ce (v) ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 006aac698 -0.4 -0.8 -1.2 v be (v) 0.0 i c (ma) -10 -1 -10 4 -10 3 -1 -10 2 -10 (1) (2) (3) 006aac699 -10 -1 -10 -2 -1 v cesat (v) -10 -3 i c (ma) -10 -1 -10 4 -10 3 -1 -10 2 -10 (1) (2) (3)
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 15 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors v ce = ?1v (1) t amb = 100 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c t amb =25 ? c fig 19. h fe selection -25: dc current gain as a function of collector current; typical values fig 20. h fe selection -25: collector current as a function of collector-emitter voltage; typical values v ce = ?1v (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 100 ? c i c /i b =10 (1) t amb = 100 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c fig 21. h fe selection -25: base-emitter voltage as a function of collector current; typical values fig 22. h fe selection -25: collecto r-emitter saturation voltage as a function of collector current; typical values 006aac707 200 100 300 400 h fe 0 i c (a) -10 -4 -10 -1 -10 -3 -10 -1 -10 -2 (1) (2) (3) 006aab404 0 i c (a) v ce (v) ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 006aac708 -0.4 -0.8 -1.2 v be (v) 0.0 i c (ma) -10 -1 -10 4 -10 3 -1 -10 2 -10 (1) (2) (3) 006aac709 ?10 ?1 ?10 ?2 ?1 v cesat (v) ?10 ?3 i c (ma) ?10 ?1 ?10 4 ?10 3 ?1 ?10 2 ?10 (1) (2) (3)
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 16 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors 8. test information 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications. 9. package outline fig 23. package outline sot223 (sc-73) fig 24. package outline sot89 (sc-62/to-243) 04-11-10 dimensions in mm 6.7 6.3 3.1 2.9 1.8 1.5 7.3 6.7 3.7 3.3 1.1 0.7 13 2 4 4.6 2.3 0.8 0.6 0.32 0.22 06-08-29 dimensions in mm 4.6 4.4 1.8 1.4 1.6 1.4 1.2 0.8 3 1.5 0.48 0.35 0.44 0.23 0.53 0.40 2.6 2.4 4.25 3.75 123
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 17 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . [2] valid for all avail able selection groups. [3] t1: normal taping [4] t3: 90 ? rotated taping fig 25. package outline sot1061 (huson3) 09-11-12 dimensions in mm 0.65 max 2.1 1.9 1.6 1.4 0.35 0.25 0.45 0.35 2.1 1.9 1.1 0.9 0.3 0.2 1.05 0.95 1.3 2 3 1 table 9. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number [2] package description packing quantity 1000 3000 4000 bcp69 sot223 8 mm pitch, 12 mm tape and reel -115 - -135 bc869 sot89 8 mm pitch, 12 mm tape and reel; t1 [3] -115 - -135 8 mm pitch, 12 mm tape and reel; t3 [4] -146 - - bc69pa sot1061 4 mm pitch, 8 mm tape and reel - -115 -
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 18 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors 11. soldering fig 26. reflow soldering footprint sot223 (sc-73) fig 27. wave soldering footprint sot223 (sc-73) sot223_fr 1.2 (4) 1.2 (3) 1.3 (4) 1.3 (3) 6.15 7 3.85 3.6 3.5 0.3 3.9 7.65 2.3 2.3 6.1 4 23 1 solder lands solder resist occupied area solder paste dimensions in mm sot223_fw 1.9 6.7 8.9 8.7 1.9 (3) 1.9 (2) 1.1 6.2 2.7 2.7 2 4 3 1 solder lands solder resist occupied area preferred transport direction during soldering dimensions in mm
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 19 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors fig 28. reflow soldering footprint sot89 (sc-62/to-243) fig 29. wave soldering footprint sot89 (sc-62/to-243) solder lands solder resist occupied area solder paste sot089_fr 1.2 1.9 2 2.25 4.75 1 (3) 0.7 (3) 0.6 (3) 1.1 (2) 1.2 0.85 0.2 0.5 1.7 4.85 3.95 4.6 1.5 1.5 dimensions in mm solder lands solder resist occupied area preferred transport direction during soldering sot089_fw 0.7 5.3 6.6 2.4 3.5 0.5 1.8 (2) 1.5 (2) 7.6 1.9 1.9 dimensions in mm
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 20 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors reflow soldering is the only recommended soldering method. fig 30. reflow soldering footprint sot1061 (huson3) occupied area solder paste = solder lands dimensions in mm sot1061_fr solder resist 0.4 2.1 1.3 0.25 0.25 0.25 1.1 1.2 0.55 0.6 2.3 0.5 (2) 0.5 (2 ) 0.6 (2) 0.4 (2) 0.5 1.6 1.7 1.05
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 21 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors 12. revision history table 10. revision history document id release date data sheet status change notice supersedes bcp69_bc869_bc69pa v.7 20111012 product data sheet - bc869_6 bcp69_6 modifications: ? the format of this document has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? type number bc69pa added ? type number bcp69-16/dg and bcp69-16/in removed ? section 1 ? product profile ? : updated ? section 2 ? pinning information ? : updated ? section 3 ? ordering information ? : updated ? section 4 ? marking ? : updated ? section 10 ? packing information ? :updated ? table 6 , 7 and 8 : updated according to latest measurements ? figure 1 , 15 to 18 updated ? figure 2 to 14 , 24 to 25 , 28 to 30 : added bc869_6 20041108 product data sheet - bc869_5 bc869_5 20031202 product specification - bc869_4 bc869_4 19990408 product specification - bc869_3 bc869_3 19980716 product specification - bc869_cnv_2 bc869_cnv_2 19970401 product specification - - bcp69_6 20081202 product data sheet - bcp69_5 bcp69_5 20031125 product specification - bcp69_4 bcp69_4 20021115 product specification - bcp69_3 bcp69_3 19990408 product specification - bcp69_cnv_2 bcp69_cnv_2 19970312 product specification - -
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 22 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? 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aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
bcp69_bc869_bc69pa all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserve d. product data sheet rev. 7 ? 12 october 2011 23 of 24 nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors bcp69; bc869; bc69pa 20 v, 2 a pnp medium power transistors ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 12 october 2011 document identifier: bcp69_bc869_bc69pa please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 thermal characteristics . . . . . . . . . . . . . . . . . . 6 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 test information . . . . . . . . . . . . . . . . . . . . . . . . 16 8.1 quality information . . . . . . . . . . . . . . . . . . . . . 16 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 10 packing information . . . . . . . . . . . . . . . . . . . . 17 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 22 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23 14 contact information. . . . . . . . . . . . . . . . . . . . . 23 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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